منابع مشابه
Pattern Photoresist Silicon Silicon Nitride Silicon Photoresist Silicon Nitride Silicon Etch Nitride Remove Photoresist
In this proposal we seek to establish a porous silicon based etching process in the WTC microfabrication laboratory. The new process will allow us to etch high aspect ratio holes through a wafer. Holes like these are important for decreasing the dead volume of connections between micro and macro systems and for increasing the complexity of micro-fluidic systems. At the present time, the minimum...
متن کاملPhotoresist Deposition Without Spinning
A technique for resist deposition using a novel fluid ejection method is presented in this paper. An ejector has been developed to deposit photoresist on silicon wafers without spinning. Drop-on-demand coating of the wafer reduces waste and the cost of coating wafers. Shipley 1400-21, 1400-27, 1805, and 1813 resists were used to coat sample 3and 4-in wafers. Later, these wafers were exposed and...
متن کاملAdvanced Simulation Techniques for Thick Photoresist Lithography
A great deal of photolithographic activity in recent years has been centered on thick photoresist films. Thin film heads (TFH), micromachining and sensor fabrication are examples of applications requiring this type of processing. The needs of the TFH industry are currently the technology driver for thick photoresist processing. Modern TFH manufacturing processes require 1 μm resolution in layer...
متن کاملUltrasonic Sensor for Photoresist Process Monitoring
An ultrasonic sensor has been developed to monitor photoresist processing in situ during semiconductor manufacturing. Photoresist development, pre-exposure bake, and postexposure bake were monitored for the Shipley 1800 series I-line resists, and the pre-exposure bake of Shipley APEX-E deep-uv (DUV) resist was monitored as well. Development monitoring was achieved by measuring thickness changes...
متن کاملSoftbake of Photoresist Films
After coating, the resist film contains a remaining solvent concentration depending on the resist, the solvent, the resist film thickness and the resist coating technique. The softbake reduces the remaining solvent content in order to: avoid mask contamination and/or sticking to the mask, prevent popping or foaming of the resist by N2 created during exposure, improve resist adhesion to the subs...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Kobunshi
سال: 1992
ISSN: 0454-1138,2185-9825
DOI: 10.1295/kobunshi.41.488